Heat Sink Compound - LE300 Thermal Paste – 30 grams

Price: 220.00INR 210.00INR
Ex Tax: 210.00INR
Product Code:  LE300 - 30 Gram
Availability:  In Stock
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Heat Sink Compound - LE300 Thermal Paste – 30 grams

Overview:

LE series thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As LE series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life.
 

Typical Application:

  • Between Semiconductor and heatsink
  • Between CPU and heatsink
  • Between power resistor and base
  • Thermoelectric cooler
  • The surface of temperature regulator and assembly
  • High-power LED lighting
  • Amplifier building

Datasheet Click here

 

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